Wandtung

AI Data Center Solution

High-density power and cooling architecture for AI training and inference infrastructure.

The Problem

Customer Challenge

AI training and inference racks draw far more power per rack than traditional IT loads, exceeding what standard air cooling and PDU designs can support, and requiring careful electrical and thermal capacity planning.

The Approach

Solution Architecture

Wandtung pairs high power three-phase PDUs and high-capacity UPS with liquid cooling (cold plate + CDU) to support dense GPU/AI racks, with monitoring tuned to track power and thermal headroom in real time.

System

System Components

High Power PDU

Three-phase, high-current distribution for GPU/AI racks.

High-Capacity UPS

Sized for sustained high-density load.

Liquid Cooling & CDU

Cold plate direct-to-chip cooling with CDU loop management.

Architecture

How It Works

  1. 1

    High power PDUs distribute three-phase power to dense GPU racks with balanced phase loading.

  2. 2

    Liquid cooling removes heat directly at the chip level via cold plates.

  3. 3

    A CDU manages the primary/secondary coolant loops and monitors flow and temperature.

Configuration

Product Configuration

Advantages

Technical Advantages

  • Supports rack densities beyond air-cooling limits
  • Balanced three-phase power design for GPU clusters
  • Integrated leak detection and thermal monitoring

Process

Deployment Process

  1. Step 1

    Density & Load Planning

    Define target kW per rack and cooling method.

  2. Step 2

    Power Architecture

    Design high power PDU and UPS distribution.

  3. Step 3

    Cooling Integration

    Deploy CDU and cold plate liquid cooling loops.

  4. Step 4

    Commissioning

    Validate power balance, cooling performance and monitoring.

Deployment

Typical Applications

AI training clustersGPU inference farmsHPC compute centers

FAQ

Frequently Asked Questions

AI training and GPU racks can draw many times the power density of traditional servers, generating heat loads that exceed what air cooling can economically remove at rack level — liquid cooling extracts heat directly at the chip, enabling much higher density per rack.

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